A system in a package is more than one single integrated circuit in a standard package or a bare chip (bare die). First of all it encompasses additional sensor elements. They typically consist of a micro mechanic sensor element and an IC for signal processing in one package. For our system in package solutions we combine our skills. We are not only specialized in integrated circuits, but also in handling sensors and chip packages. Combined with the modular high-voltage CMOS technology, which is well established since many years, ELMOS has become a supplier of silicon based sub-systems. We are able to manufacture products, which combine everything in a few millimeters space.
The package includes active and passive components integrated in a cavity overmoulded package. This system for example is able to measure the oil quality in the automobile: even highest temperatures over a long period do not influence the performance of the system.